RELIFE RL-401 30g Tin Soldering Paste 183°C
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Prices updated: 13 Oct 2026
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About this product
RELIFE RL-401 is a 30 g tin soldering paste with a listed melting point of 183 °C. It is applied to PCB pads with a stencil or syringe and used for reflow or hot-air soldering of SMD components, making it a practical choice for surface-mount repair and assembly.
Specifications
- Net weight
- 30 g
- Melting point
- 183 °C
- Type
- Tin soldering paste
- Application
- Reflow / hot-air SMD soldering
Frequently asked questions
Can I use this paste with a normal soldering iron?
Solder paste is designed mainly for reflow or hot-air SMD work. For hand soldering of through-hole parts, use solder wire instead.
What should I do before dispensing the paste?
Bring the paste to room temperature and stir it gently so the flux and solder particles are evenly mixed before applying it to the pads.
