Mechanic Solder Paste 42g for Rework, BGA and Stencil Printing
Currently unavailable
No store has this product in stock right now. Prices below are the last ones we recorded.
Prices updated: 13 Oct 2026
Price history
Lowest daily price, last 90 days
Not enough price history yet.
About this product
Solder paste from Mechanic, supplied in a 42 g package. It is intended for reflow soldering, including rework and attaching solder spheres to BGA, CGA and CSP packages. It can be dispensed, screen printed or stencil printed, and the listing highlights long stencil life and low voiding.
Specifications
- Net weight
- 42 g
- Applications
- Rework, BGA/CGA/CSP sphere attachment
- Application methods
- Dot dispensing, screen printing, stencil printing
- Key features
- Long stencil life, wide process window, low voiding
- Printing head compatibility
- Compatible with enclosed printing heads
Frequently asked questions
How is this paste applied to a BGA chip?
It can be applied through a stencil, screen printed or dispensed in dots, and then reflowed with a hot-air station or reflow oven. Clean the pad area first and follow a reflow profile suitable for the paste.
Is it compatible with my PCB surface finish?
The listing states excellent wetting compatibility on most board finishes. Confirm your PCB surface finish and follow the reflow temperature guidance from the manufacturer's data for this paste.
