Sn63/Pb37 Metallic Solder Paste 15 g for SMD and BGA Rework
Prices updated: 13 Oct 2026
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| Store | product | Price | View in store |
|---|---|---|---|
 Most Electronics | Metallic Solder Paste 15g | 150 EGP198 | View in store |
Price history
Lowest daily price, last 90 days
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Lowest price recorded: 150 EGP
About this product
A 15 g Sn63/Pb37 metallic solder paste with 30–45 µm particle size, designed for soldering and rework of SMD, BGA and PGA components. It can be applied by stencil printing or dispensing and reflowed with a hot air or SMT/BGA rework station. It can also be used with a tin soldering iron for repairs on laptops, phones and other sensitive boards.
Specifications
- Alloy
- Sn63/Pb37
- Net weight
- 15 g
- Particle size
- 30–45 µm
- Melting range
- 185–240 °C
- Stencil suitability
- Openings larger than 0.45 mm
- Typical application
- SMD, BGA and PGA rework
Frequently asked questions
What is the price of Sn63/Pb37 Metallic Solder Paste 15 g for SMD and BGA Rework in Egypt?
Sn63/Pb37 Metallic Solder Paste 15 g for SMD and BGA Rework currently costs 150 EGP in Egypt.
Where can I buy Sn63/Pb37 Metallic Solder Paste 15 g for SMD and BGA Rework in Egypt?
Sn63/Pb37 Metallic Solder Paste 15 g for SMD and BGA Rework is available from Most Electronics. Compare the offers above to find the best price.
What equipment do I need to use this solder paste?
Apply it with a stencil or syringe, then reflow it with a hot air station or an SMT/BGA rework station. For stencil printing, the stencil openings should be larger than 0.45 mm. A tin soldering iron can be used for touch-up work.
Is this solder paste safe to handle?
It contains lead (Pb 37%). Work in a ventilated area, avoid inhaling fumes, wash your hands after use, and do not eat or drink near the paste.
