MAANT MY-17A Solder Paste 217°C for BGA and SMD Soldering
Currently unavailable
No store has this product in stock right now. Prices below are the last ones we recorded.
Prices updated: 13 Oct 2026
Price history
Lowest daily price, last 90 days
Not enough price history yet.
About this product
A flux-based solder paste with a rated melting point of 217 °C, used for BGA and surface-mount (SMD) soldering and rework. It is applied through a stencil or syringe and then reflowed with hot air or a reflow oven.
Specifications
- Type
- Solder paste with flux / معجون لحام مع فلاكس
- Melting temperature
- 217 °C
- Application
- BGA and SMD soldering / لحام BGA والتركيب السطحي
- Brand
- MAANT
Frequently asked questions
How do I apply this solder paste?
Apply a thin, even layer through a stencil or syringe onto the pads, place the components, then reflow with hot air or an oven following a suitable temperature profile.
Can I use it for through-hole components?
This paste is intended for surface-mount and BGA work. For through-hole parts, solder wire applied with an iron is the usual method.
