Relife RL-044 Universal BGA Stencil 0.12mm, Parallel & 45° Holes
Prices updated: 13 Oct 2026
Compare prices
| Store | product | Price | View in store |
|---|---|---|---|
 Microohm | Relife RL-044 0.12MM Universal Solder Multi-Purpose BGA Stencil 0.3 / 0.35 / 0.4 / 0.5 / Parallel / 45 Degree Hole | 225 EGP300 | View in store |
Price history
Lowest daily price, last 90 days
Lowest price recorded: 225 EGP
About this product
A universal metal BGA reballing stencil for repairing chips with solder balls. It has 0.12 mm apertures in both parallel and 45-degree hole layouts, and is listed for chip sizes from 0.3 mm to 0.5 mm. It is used to place solder balls accurately before reflow.
Specifications
- Aperture
- 0.12 mm / 0.12 مم
- Hole layouts
- Parallel and 45-degree / متوازٍ و45 درجة
- Compatible range
- 0.3–0.5 mm / 0.3–0.5 مم
- Material
- Metal / معدن
Frequently asked questions
What is the price of Relife RL-044 Universal BGA Stencil 0.12mm, Parallel & 45° Holes in Egypt?
Relife RL-044 Universal BGA Stencil 0.12mm, Parallel & 45° Holes currently costs 225 EGP in Egypt.
Where can I buy Relife RL-044 Universal BGA Stencil 0.12mm, Parallel & 45° Holes in Egypt?
Relife RL-044 Universal BGA Stencil 0.12mm, Parallel & 45° Holes is available from Microohm. Compare the offers above to find the best price.
How do I choose the right stencil for my chip?
Match the stencil's hole layout and size to your BGA chip's pad layout and ball size. The listing covers chip sizes from 0.3 mm to 0.5 mm.
How is the stencil used with solder balls?
Place the stencil over the cleaned chip pads, spread the balls across the openings so that each opening takes one ball, then heat the chip so the balls reflow onto the pads.
