OSEPP LS-00018 Solderless Breadboard, 400 Tie Points
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Prices updated: 12 Oct 2026
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About this product
A solderless prototyping breadboard from OSEPP with 400 tie points, used to build and test circuits without soldering. Components and jumper wires are pushed into its spring-clip contacts, making it a common choice for learning and early prototyping.
Specifications
- Tie points
- 400
- Type
- Solderless breadboard
- Contact pitch
- 2.54 mm
Frequently asked questions
Does it work with Arduino or ESP32 headers and jumper wires?
Yes. Standard 2.54 mm pitch headers and jumper wires fit its contacts.
How do I use the power rails?
The long rails along the edges are typically used for supply and ground. Check the markings on the board to confirm whether each rail is continuous or split.
